[翻译]
Keynotes & Papers
Keynotes & Papers
Keynote Presentation
2024 – Test Innovations: Crossing the Chasm to a Chiplet Ecosystem at 3D Systems Summit
Published Paper
2024 – Expediting manufacturing safe launch with Big Data AI/ML analytic solutions on the cloud
Published Paper
EDTM 2022 - 用于检测和监控的新型电子束技术
Published Paper
EDTM 2022 - BEOL 叠加和工艺边际特征描述的新方法
Published Paper
NANOTS 2021 - 利用 DirectScan 进行先进的高通量电子束检测
Published Paper
APCSM 2020 - 将机器学习与先进的异常值检测相结合,提高质量并降低成本
Published Paper
IEEE S3S 2019 - FDSOI 技术的表征挑战与解决方案
Published Paper
IEEE JEDS 2019 - 用于鉴定新兴存储器的短流程测试阵列的设计和测量要求
Published Paper
EDTM 2019 - 7 纳米及以下工艺的良品率和可靠性挑战
Published Paper
EDTM 2019 - 用于鉴定新兴存储器的短流程测试阵列的设计和测量要求
Published Paper
IEEE Transactions 2015 - 用于 FinFET 技术特征描述的接触链
Categories
Tags
- Data
- Secure Data
- Data & Annalytics
- AI Driven Test
- OEE
- Chiplet ecosystem
- DFF
- Agentic AI
- Supply Chain
- Predictive Learning
- FDC
- Emerging Memories
- Parametric Test
- Compound Semiconductors
- AI/ML
- 过程控制
- Manufacturing
- Electric vehicles
- Design for Manufacturing
- Characterization
- Modeling
- Voltage Contrast
- e-Beam
- Yield Management
- Silicon Carbide
- 制造分析