Analytics for Compound Semiconductors Presentation Download

Explore our in-depth presentation on how PDF Solutions’ Exensio® platform is revolutionizing silicon carbide (SiC) manufacturing. Gain insights into defect management, AI-powered process control, and enhanced equipment connectivity—all designed to tackle the challenges of transitioning to 200mm wafers and improving yield. Discover how industry leaders are achieving end-to-end deployment success with scalable analytics.

Download the full presentation to stay ahead in the fast-evolving SiC industry!