eProbe Update – DirectScan: Technology, Application and Adoption – Download
eProbe DirectScan addresses the challenges of next-generation semiconductor scaling, where 3D process integration and complex Front End of Line (FEOL) structures require electrical resolution beyond optical capabilities. By integrating eProbe PointScan, FIRE, and Exensio, DirectScan offers a comprehensive voltage contrast inspection solution that is 20-100x faster than conventional single-beam tools for sparse inspections. This technology enables design-aware inspection and product-based learning, allowing for the rapid identification of systematic defects and layout weaknesses in advanced Logic and DRAM nodes.
Download the full presentation to explore how PointScan minimizes wafer charging for Backside Power Delivery Network (BSPDN) applications and enables controlled “charge and sense” methodologies for storage node short detection.
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