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已发表论文

已发表论文
Published Paper
2025-Full Wafer Inspection for Voltage Contrast Systematic Defects Using High-Throughput Point Scan
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2025-Stress-related Local Layout Effects in FinFET Technology and Device Design Sensitivity
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2025-Product Design Enhancement with Test Structures for Non-Contact Detection of Yield Detractors
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2025-The Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap
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2025-Full-chip Voltage Contrast Inference Using Deep Learning; You Only Look Once: Voltage Contrast (YOLO-VC)
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2024 – Expediting manufacturing safe launch with Big Data AI/ML analytic solutions on the cloud
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EDTM 2022 - 用于检测和监控的新型电子束技术
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EDTM 2022 - BEOL 叠加和工艺边际特征描述的新方法
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NANOTS 2021 - 利用 DirectScan 进行先进的高通量电子束检测
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APCSM 2020 - 将机器学习与先进的异常值检测相结合,提高质量并降低成本
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IEEE S3S 2019 - FDSOI 技术的表征挑战与解决方案
Categories
Tags
- AI/ML
- AI Driven Test
- OEE
- Chiplet ecosystem
- DFF
- Agentic AI
- Supply Chain
- Predictive Learning
- FDC
- Emerging Memories
- Parametric Test
- Data
- Compound Semiconductors
- 过程控制
- Manufacturing
- Electric vehicles
- Design for Manufacturing
- Characterization
- Modeling
- Voltage Contrast
- e-Beam
- Yield Management
- Silicon Carbide
- 制造分析